BGA Introduction


BGA is called Ball Grid Array, it is like ball size point stand, BGA begain to be used in 1990s. It is most used in advanced components’ package. In 1996-2001, it devlopped very quickly.In 1999, reached to 1billion. BGA is just used in HDI and High performance components. most used in PC IC, control board, ASIC, DSP,PDA,PLD and so on components.
The pins are placed in a grid pattern (hence the name Ball Grid Array) on the under-surface of the chip carrier. Also rather than having pins to provide the connectivity, pads with balls of solder are used as the method of connection. On the printed circuit board, PCB, onto which the device is to be fitted there is a matching set of copper pads to provide the required connectivity.
Apart from the improvement in connectivity, it have other advantages. They offer a lower thermal resistance between the silicon chip itself than quad flat pack devices. This allows heat generated by the integrated circuit inside the package to be conducted out of the device onto the PCB faster and more effectively. In this way it is possible for
devices to generate more heat without the need for special cooling measures.

In addition to this the fact that the conductors are on the underside of the chip carrier means that the leads within the chip are shorter. Accordingly unwanted lead inductance levels are lower, and in this way, Ball Grid Array devices are able to offer a higher level of performance than their QFP counterparts.
it has many types, as outsize: Square and Rectangle; as solder point position: above, mixed. Standard BGA.
• PBGA – Plastic Ball Grid Array: This BGA package is intended for mid- to high-performance devices that require low inductance, ease of surface mounting, relatively low cost, while also retaining high levels of reliability. It has some additional copper layers in the substrate that enable increased power dissipation levels to be handled.
• CBGA – Ceramic ball Sdd array: This package provides for much higher heat dissipation levels. It uses thick copper planes in the substrate to draw heat from the die to the customer board.
• TBGA – Tape Ball Grid Array: This BGA package is a mid- to high-end solution for applications needing high thermal performance without an external heatsink.

BGA repair / BGA reballing
Once removed, the BGA can be replaced with a new one. Occasionally it may be possible to refurbish or repair a BGA that has been removed. This BGA repair may be an attractive proposition if the chip is expensive and it is known to be a working device once removed. Undertake a BGA repair it needs to have the solder balls replaced in a process known as reballing. This BGA repair can be undertaken using some of the small ready-made solder balls that are manufactured and sold for this purpose.
There are many organisations that have been set up with specialist equipment to undertake this BGA reballing.


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